TANAKA to Exhibit at SEMICON Taiwan 2026, September 2-4 in Taipei, Taiwan

Showcasing a broad range of semiconductor materials and technologies, from plating solutions to precious metal recycling

August 28, 2026

TANAKA will exhibit at SEMICON Taiwan 2026, taking place from September 2 to 4, 2026, at TaiNEX Hall 2 in Taipei, Taiwan. TANAKA will welcome visitors at Booth S7858.

At the exhibition, TANAKA will showcase a wide range of products and technologies for semiconductor manufacturing, including Bonding Wires, Plating Solutions, Probe Pin Materials, Precious Metals Precursors for CVD/ALD Deposition, Silver Adhesive Pastes for Die-bonding, AgSn TLP Sheet, AuRoFUSE™ Preform, Active Brazing Filler Metals and Active Brazing Filler Metal/Copper Composite Material, and Precious Metal Recycling.

TANAKA will also give a presentation on "Die Attach Materials" at TECHXPOT on September 3, 2026

We look forward to welcoming you at Booth S7858.

For more information on TANAKA's products and technologies for the semiconductor industry, please visit:
Semiconductor Fabrication and TANAKA

For more information about SEMICON Taiwan 2026, please visit the official event website:
SEMICON Taiwan 2026