TANAKA Partners with CITC/TNO to Advance Next-Generation Semiconductor Packaging Technologies

October 1, 2026

TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. has partnered with the Netherlands Organisation for Applied Scientific Research (TNO) to advance research and development in next-generation semiconductor packaging technologies through the Chip Integration Technology Center (CITC) in Nijmegen, the Netherlands. CITC, part of TNO, specializes in advanced semiconductor back-end assembly, test and packaging design, connecting industry, academia, and research organizations.

Through this Japanese/European collaboration, TANAKA will combine its expertise in precious metal materials with CITC's research capabilities and collaborative network. This accelerates the development and evaluation of next-generation packaging materials, including silver- and copper-based adhesive pastes for die/clip-bonding.

This three-year partnership commences in October 2026.

Learn more about TANAKA's products and solutions for power devices:
https://tanaka-preciousmetals.com/en/products/solution/power-device.html

Learn more about CITC/TNO's semiconductor package services:
https://www.citc.org/